Electronic device comprising heat dissipation structure

An electronic device comprising:

• a housing having a first surface and a second surface facing in a direction opposite to the first surface;
• a first support member accommodated in a space between the first surface and the second surface and including, at least in part, a thermally conductive material, a display disposed between the first surface and the first support member;
• a printed circuit board disposed between the second surface and the first support member;
• an integrated circuit chip disposed on one surface of the printed circuit board between the first support member and the printed circuit board and provided with at least one processor and memory;
• a compressible solid-state thermal interface material having one surface at least a portion of which is in contact with the integrated circuit chip and another surface at least a portion of which is in contact with the first support member, the thermal interface material being configured to transfer heat between the at least one processor and the first support member or between the memory and the first support member;
• and
• a shielding film partially attached to the thermal interface material between the thermal interface material and the first support member and providing a first opening configured to allow a portion of the other surface of the thermal interface material to be attached to the first support member,
• wherein the thermal interface material includes a first portion in contact with the integrated circuit chip and a second portion laterally protruding from the first portion, and
• wherein the second portion is at least partially attached to the shielding film.