Heat sink unit, heat sink assembly and electronic device

A heat sink assembly, comprising:

• a first heat sink unit, comprising:
• a first plate portion, the first plate portion comprising at least one protrusion;
• and
• a second plate portion, the second plate portion being connected to the first plate portion, wherein the first plate portion and the second plate portion are integrally formed, and a first angle between the first plate portion and the second plate portion is between 5 degrees and 175 degrees;
• and
• a second heat sink unit, comprising:
• a fifth plate portion;
• and
• a sixth plate portion, the sixth plate portion being connected to the fifth plate portion, wherein a second angle between the fifth plate portion and the sixth plate portion is between 5 degrees and 175 degrees;
• wherein the first heat sink unit is connected to the second heat sink unit.

An electronic device, comprising:

• a heat sink unit, comprising:
• a first plate portion, comprising at least one protrusion;
• and
• a second plate portion, the second plate portion being connected to the first plate portion, wherein the first plate portion and the second plate portion are integrally formed, and a first angle between the first plate portion and the second plate portion is between 5 degrees and 175 degrees;
• and
• at least one circuit board assembly, comprising at least one circuit board and at least one electronic component, the least one electronic component being disposed on the at least one circuit board and connected to the at least one protrusion.