Semiconductor device

A semiconductor device, comprising:

• a first case including a base plate and a heat dissipation chamber assembly, the heat dissipation chamber assembly including a heat diffusion chamber;
• a second case;
• a substrate between the first case and the second case;
• and
• at least one electronic component on the substrate,
• wherein the heat diffusion chamber overlaps and thermally contacts the at least one electronic component,
• wherein the heat dissipation chamber assembly includes:
• a first chamber plate and a second chamber plate, with at least one of the first chamber plate or the second chamber plate in a cavity of the first case;
• and
• a sidewall structure extending vertically toward the substrate from any one of the first chamber plate and the second chamber plate, the sidewall structure surrounding the at least one electronic component.

A semiconductor device, comprising:

• a first case including a base plate;
• a second case;
• a substrate between the first case and the second case;
• at least one electronic component on the substrate;
• and
• a heat dissipation chamber assembly between the substrate and at least a portion of the first case, the heat dissipation chamber assembly including:
• a heat diffusion chamber in thermal contact with the at least one electronic component;
• at least one chamber plate, the at least one chamber plate defining the heat diffusion chamber;
• and
• a sidewall structure extending vertically toward the substrate from the at least one chamber plate and surrounding the at least one electronic component,
• wherein the sidewall structure includes at least a first sidewall and a second sidewall extending in a horizontal direction such that the first sidewall and the second sidewall define at least one receiving groove surrounding the at least one electronic component.