Heat dissipation apparatus and method for manufacturing heat dissipation apparatus

A heat dissipation apparatus, comprising:

• a cover body, a flow-uniformizing component and a bottom board component, wherein
• the bottom board component comprises a heat dissipation chamber, a plurality of heat conduction members are arranged in a first region of the heat dissipation chamber at a first interval, a plurality of heat conduction members are arranged in a second region of the heat dissipation chamber at a second interval, wherein the first interval is smaller than the second interval;
• the flow-uniformizing component at least covers the heat dissipation chamber, a third region of the flow-uniformizing component comprises a plurality of first flow-uniformizing channels and a plurality of first liquid drain channels, the first flow-uniformizing channels and the first liquid drain channels are arranged alternately, the first flow-uniformizing channels are provided with a plurality of first liquid outlet holes at a third interval, the first liquid outlet holes communicate with the first flow-uniformizing channels and the first region, a fourth region of the flow-uniformizing component comprises a plurality of second flow-uniformizing channels and a plurality of second liquid drain channels, the second flow-uniformizing channels and the second liquid drain channels are arranged alternately, the second flow-uniformizing channels are provided with a plurality of second liquid outlet holes at a fourth interval, the second liquid outlet holes communicate with the second flow-uniformizing channels and the second region, and the first liquid drain channels communicate with the first region and the second flow-uniformizing channels;
• the cover body covers the flow-uniformizing component, the cover body is provided with a liquid inlet and a liquid outlet, the liquid inlet communicates with the first flow-uniformizing channels, and the second liquid drain channels communicate with the second region and the liquid outlet;
• and
• in a case that a chip is in a mounted state, a face of the bottom board component away from the flow-uniformizing component makes contact with the chip, a fifth region of the chip corresponds to the first region, a sixth region of the chip corresponds to the second region, wherein a temperature of the fifth region is higher than a temperature of the sixth region.