Non-uniform heatsink fin geometry for increased thermal performance

A card-based processing subsystem, comprising:

• a housing;
• a processor mounted on a printed circuit board that is disposed within the housing;
• and
• a heatsink that is coupled to the processor, wherein the heatsink comprises:
• a plurality of cooling fins,
• wherein a first cooling fin included in the plurality of cooling fins has a first portion with a first height and a second portion with a second height that is less than the first height, and
• wherein each of the first height and the second height is measured in a direction that is parallel with a direction of cooling air flowing across the plurality of cooling fins.