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US 2026/0089844 A1Published application
Electronic device and manufacturing method for electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorTakushi SHIGETOSHI
Life of this patent
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Abstract
An electronic device includes a substrate, a first through-hole penetrating the substrate, a capacitive element above the substrate, and a first conductor film. A first portion of the first conductor film traverses the substrate along a side wall of the first through-hole and a second portion of the first conductor film is in contact with the capacitive element.
Claims31
An electronic device, comprising:
- a substrate;
- a first through-hole penetrating the substrate;
- a capacitive element above the substrate;
- and
- a first conductor film, wherein a first portion of the first conductor film traverses the substrate along a side wall of the first through-hole and a second portion of the first conductor film is in contact with the capacitive element.
2 more elements
An electronic device, comprising:
- a substrate;
- a capacitive element above the substrate;
- and
- a through electrode penetrating the substrate and the capacitive element.
1 more element
An electronic device, comprising:
- a semiconductor substrate;
- a wiring layer on a front face side of the semiconductor substrate;
- a through electrode that penetrates the semiconductor substrate and connects to the wiring layer;
- a trench in a rear face of the semiconductor substrate;
- a capacitive element embedded in the trench;
- and
- a wiring that connects the through electrode to the capacitive element.
4 more elements
A method for manufacturing an electronic device, the method comprising:
- forming a capacitive element on a substrate;
- forming a through-hole in the substrate;
- and
- forming a through electrode along a side wall of the through-hole, wherein the through electrode is electrically connected to the capacitive element.
1 more element
Dependencies are inferred from the claim text.