Gas spraying apparatus, substrate processing apparatus, and thin film deposition method
AssigneeJusung Engineering Co., Ltd.
InventorsWon Tae CHO, Chul Joo HWANG
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AssigneeJusung Engineering Co., Ltd.
InventorsWon Tae CHO, Chul Joo HWANG
Estimating the term…
The present disclosure relates to an apparatus for injecting a gas, an apparatus for processing a substrate, and a method for depositing a thin-film, and more specifically, to an apparatus for injecting a gas to deposit a thin-film by injecting a gas to a substrate, an apparatus for processing a substrate, and a method for depositing a thin-film. An apparatus for injecting a gas in accordance with an exemplary embodiment includes: a first electrode in which a first gas supply path and a second gas supply path are separately defined and which has first and second gas supply holes connected to the first and second gas supply paths, respectively; and a second electrode which is electrically insulated from and spaced apart from the first electrode and has a plurality of openings arranged alternately with the first and second supply holes.
A first electrode in which a first gas supply path and a second gas supply path are separately defined and which has first and second gas supply holes connected to the first and second gas supply paths, respectively;
Dependencies are inferred from the claim text.