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US 2026/0087206 A1Published application
Simulation method of resin curing reaction
AssigneeKabushiki Kaisha Toshiba
InventorDaisuke HIRATSUKA
Life of this patent
Estimating the term…
Abstract
A simulation method of a resin curing reaction, includes estimating a cure degree of a resin included in a plurality of workpieces inside a furnace by performing a coupled analysis including a thermal fluid analysis and an analysis of a master curve, the master curve representing a relationship between a temperature history and the cure degree of the resin, and based on a result of the estimating, extracting a portion having slowest curing of the resin among the plurality of workpieces.
Claims5
A simulation method of a resin curing reaction, comprising:
- estimating a cure degree of a resin included in a plurality of workpieces inside a furnace by performing a coupled analysis including a thermal fluid analysis and an analysis of a master curve, the master curve representing a relationship between a temperature history and the cure degree of the resin;
- and
- based on a result of the estimating, extracting a portion having slowest curing of the resin among the plurality of workpieces.
Dependencies are inferred from the claim text.