Semiconductor device manufacturing method

Abstract

A semiconductor device manufacturing method of embodiments includes: performing a first supply of a chemical solution from an application nozzle onto a surface of a wafer; storing the application nozzle in a container; performing a second supply of a solvent into the container; measuring first defects in the solvent discharged from the container; performing the first supply of the chemical solution from the application nozzle onto the surface of the wafer when the number of first defects is less than a first threshold value; and continuing the second supply of the solvent into the container when the number of first defects is equal to or greater than the first threshold value.

Dependencies are inferred from the claim text.