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US 2026/0085898 A1Published application
Dual mode heatsink
AssigneeRaytheon Systems Limited
InventorDavid L. Gordon
Life of this patent
Estimating the term…
Abstract
A dual mode heatsink includes a base comprising a first surface arranged to receive heat energy from a heat source and a second surface; and cooling fins attached to and extending from the second surface; wherein the base further comprises at least one liquid channel arranged between the first surface and the second surface, the at least one liquid channel being defined by one or more walls forming a heat conducting connection between the first surface and the second surface.
Claims20
A dual mode heatsink comprising:
- a base comprising a first surface configured to receive heat energy from a heat source and a second surface;
- and
- cooling fins extending from the second surface;
- wherein the base further comprises at least one liquid channel arranged between the first surface and the second surface, the at least one liquid channel defined by one or more walls forming a heat conducting connection between the first surface and the second surface.
1 more element
A temperature control system comprising:
- a dual mode heatsink comprising:
- a base comprising a first surface and a second surface;
- and
- cooling fins extending from the second surface;
- wherein the base further comprises at least one liquid channel arranged between the first surface and the second surface, the at least one liquid channel defined by one or more walls forming a heat conducting connection between the first surface and the second surface;
- a heat source in thermal contact with the first surface;
- and
- at least one of:
- a gas flow generator configured to produce a gas flow past the cooling fins;
- or
- a liquid flow generator configured to produce a liquid flow through the at least one liquid channel.
8 more elements
A method of cooling a heat source, the method comprising:
- providing a dual mode heatsink comprising:
- a base comprising a first surface and a second surface;
- and
- cooling fins extending from the second surface;
- wherein the base further comprises at least one liquid channel arranged between the first surface and the second surface, the at least one liquid channel defined by one or more walls forming a heat conducting connection between the first surface and the second surface;
- arranging the first surface of the dual mode heatsink in contact with a heat source;
- and
- providing at least one of:
- a gas flow past the cooling fins;
- or
- a liquid flow through the at least one liquid channel.
8 more elements
Dependencies are inferred from the claim text.