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US 2026/0085822 A1Published application
Glass Integral Lighting
AssigneePittsburgh Glass Works, LLC
InventorKyle Fragassi
Life of this patent
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Abstract
An article may include at least one pane of glass, at least one interlayer, a plurality of light-emitting diodes (LEDs) disposed within the at least one interlayer, and at least one transparent trace providing power to the plurality of LEDs. The at least one transparent trace may be arranged relative to the at least one interlayer and at least one pane of glass such that the at least one transparent trace is not visible to a user of the article.
Claims20
An article comprising:
- at least one pane of glass;
- at least one interlayer;
- a plurality of light-emitting diodes (LEDs) disposed within the at least one interlayer;
- and
- at least one transparent trace electrically connected to the plurality of LEDs,
- wherein the at least one transparent trace is arranged relative to the at least one interlayer and at least one pane of glass such that the at least one transparent trace is not visible to a user of the article.
3 more elements
An article comprising:
- a first layer of glass;
- a first interlayer having a first side and a second side, the first side of the first interlayer facing the first layer of glass;
- a film having a first side and a second side, the first side of the film facing the second side of the first interlayer;
- a second interlayer having a first side and a second side, the first side of the second interlayer facing the second side of the film;
- a second layer of glass having a side facing the second side of the second interlayer;
- and
- transparent circuitry arranged on a surface of the first side of the film,
- wherein the first interlayer comprises at least one LED, and
- wherein the transparent circuitry is configured to provide power to the at least one LED.
6 more elements
A method of embedding at least one LED in a substrate, the method comprising the steps of:
- arranging the at least one LED on at least one interlayer of the substrate;
- heating the substrate;
- and
- applying pressure to the substrate,
- wherein heat and pressure are applied to the substrate, such that the at least one interlayer softens and the at least one LED becomes embedded therein.
2 more elements
Dependencies are inferred from the claim text.