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US 2026/0085220 A1Published application
Polishing composition and polishing method using the same
OwnerSheng-Hsuan Weiinventor
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Abstract
The present disclosure provides a polishing composition containing: abrasive grains having surfaces modified with a silane coupling agent and having a positive surface potential, and having an average secondary particle size of 45 nm or more and 100 nm or less, and a silanol group density of more than 0.0/nm2 and 3.0/nm2 or less; a surfactant which is an alkyl phosphate having 6 to 18 carbon atoms; and an aqueous dispersing medium.
Claims13
A polishing composition comprising:
- abrasive grains having surfaces modified with a silane coupling agent and having a positive surface potential, and having an average secondary particle size of 45 nm or more and 100 nm or less, and a silanol group density of more than 0.0/nm2 and 3.0/nm2 or less;
- a surfactant which is an alkyl phosphate having 6 to 18 carbon atoms;
- and
- an aqueous dispersing medium.
1 more element
Dependencies are inferred from the claim text.