Epoxy resin curing agent, epoxy resin composition, and coating agent
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorTakuma HANAOKA
Life of this patent
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Abstract
An epoxy resin curing agent containing a reaction composition (A) containing a reaction product of the following component (a12) and component (a3): component (a12): a reaction composition containing a reaction product of a polyalkylene glycol (a1) and a polyepoxy compound having a cyclic structure (a2), and component (a3): a polyamine having a cyclic structure, wherein the mass ratio of the component (a1) to a total amount of the component (a1) and the component (a2), [(a1)/{(a1)+(a2)}], is from 0.28 to 0.50, and the reaction molar ratio between the component (a12) and the component (a3), [(a12)/(a3)], is from 1/4 to 1/2.
Claims8
An epoxy resin curing agent comprising a reaction composition (A) containing a reaction product of the following component (a12) and component (a3):
- component (a12):
- a reaction composition containing a reaction product of a polyalkylene glycol (a1) and a polyepoxy compound having a cyclic structure (a2), and
- component (a3):
- a polyamine having a cyclic structure,
- wherein a mass ratio of the component (a1) to a total amount of the component (a1) and the component (a2), [(a1)/{(a1)+(a2)}], is from 0.28 to 0.50, and a reaction molar ratio between the component (a12) and the component (a3), [(a12)/(a3)], is from 1/4 to 1/2.
Dependencies are inferred from the claim text.