Upper mold device, processing apparatus having the same, and processing method

A processing method comprising:

• placing, on a lower mold device, an integrated circuit component that includes a substrate, a chip disposed on the substrate, a thermal interface material disposed on the chip, and an upper lid disposed on the thermal interface material;
• defining a processing section by connecting an upper mold device to the lower mold device for processing the integrated circuit component therein;
• with a negative pressure source, extracting gas that is in the processing section, such that a processing gas flows into the processing section and performs a redox reaction with the upper lid of the integrated circuit component so as to reduce an oxidation state of the upper lid;
• and
• applying a pressure to the upper lid with the upper mold device.

A processing method, comprising:

• placing, on a lower mold device, an integrated circuit component that includes a substrate, a chip disposed on the substrate, a thermal interface material disposed on the chip, and an upper lid disposed on the thermal interface material;
• defining a processing section by connecting an upper mold device to the lower mold device for processing the integrated circuit component therein;
• with a negative pressure source, extracting gas that is in the processing section, such that a processing gas flows into the processing section and reduces oxidation of the upper lid;
• and
• applying a pressure to the upper lid with the upper mold device.