Laser processing system

Abstract

A laser processing system of the present disclosure includes a laser processing device that irradiates a workpiece with laser light, a light detector that detects return light including at least one of thermal radiation, visible light, or reflected light, the return light being generated by irradiating the workpiece with the laser light, and a controller that controls the laser processing device, in which the controller is configured to generate waveform data indicating an intensity of the return light during processing of the workpiece based on the return light detected by the light detector, extract a feature value from the waveform data, specify a first parameter having change among a plurality of parameters related to processing of the laser processing device based on the feature value, and change a second parameter among the plurality of parameters based on the first parameter.

Dependencies are inferred from the claim text.