Yield improvement system for die stack flux removal
AssigneeVeeco Instruments Inc.
InventorsHunter Jones, Phillip Tyler, John Taddei, Robert Edwards, Mark Yannuzzi, Kevin Donnelly
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Abstract
A system for improving yield and increasing throughput on processes that remove flux and flux residues from openings between 3D semiconductor structures. The system employs high flow, directed, pressurized nitrogen to assist in de-wetting the areas between semiconductor devices where solder bumps or micro bumps attach one device to another.
Claims23
A system for removing flux from a substrate that has openings formed therein comprising:
- a spin processing chamber that includes a high flow fluid dispensing arm that is fluidly connected to a source of fluid and includes at a distal end a nozzle that is angled for delivering a controlled pressure and volume of fluid for efficient removal of fluid in and around 3D structures of semiconductor devices in order to boost yield and throughput of flux and flux residue removal processes.
A system for improving yield and increasing throughput on processes that remove flux and flux residues from openings between 3D semiconductor structures, the system comprising:
- a processing chamber;
- and
- a dispensing arm that discharges high flow, directed, pressurized nitrogen to assist in de-wetting areas between the 3D semiconductor structures where solder bumps or micro bumps attach one 3D semiconductor device to another.
Dependencies are inferred from the claim text.