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US 2026/0077442 A1Published application
Processing device and processing method
AssigneeSumitomo Heavy Industries, Ltd.
InventorsMakoto HARADA, Tatsuya KOHARA
Life of this patent
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Abstract
The present invention relates to a processing device which includes: a grindstone in which abrasive grains are dispersed in a binder containing a thermoplastic resin; and a temperature control mechanism that adjusts a temperature of a contact surface between the grindstone and a processing object according to an aspect of processing.
Claims14
A processing device comprising:
- a grindstone in which abrasive grains are dispersed in a binder containing a thermoplastic resin;
- and
- a temperature control mechanism that adjusts a temperature of a contact surface between the grindstone and a processing object according to an aspect of processing.
A processing method of processing a processing object using a grindstone in which abrasive grains are dispersed in a binder containing a thermoplastic resin, the method comprising:
- roughly grinding a surface of the processing object with the grindstone;
- and
- thereafter, raising a temperature of a contact surface between the grindstone and the processing object to perform finish processing.
A processing device comprising:
- a grindstone in which abrasive grains are dispersed in a binder containing a thermoplastic resin;
- and
- a temperature control mechanism that adjusts a temperature of the grindstone according to an aspect of processing.
Dependencies are inferred from the claim text.