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US 2026/0076412 A1Published application
Atomizing core and atomizing device
AssigneeSmoore International Holdings Limited
InventorsLiqing ZHENG, Shuting CHEN, Wei WANG, Jianming FENG, Ming TANG, Mingda ZHU
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Abstract
The present disclosure provides an atomizing core, including a substrate, where a heating film is provided on the substrate. A tantalum thin-film is provided on the surface of the heating film away from the substrate. The heating film is made of elemental metal or an alloy material having a melting point of 1400° C. or more, and a resistivity of less than 5×10−7 Ωm. The resistance of the tantalum thin-film is at least five times the resistance of the heating film.
Claims14
An atomizing core comprising:
- a substrate;
- a heating film being provided on the substrate;
- a tantalum thin-film being provided on a surface of the heating film away from the substrate, wherein a resistance of the tantalum thin-film is at least five times a resistance of the heating film;
- and
- wherein the heating film is made of elemental metal or an alloy material having a melting point of 1400° C. or more, and a resistivity of less than 5×10−7 Ωm.
2 more elements
Dependencies are inferred from the claim text.