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US 2026/0076276 A1Published application
Solderless and pressure contact connection
AssigneeLittelfuse, Inc.
InventorsTiburcio A. Maldo, Rhodri Hughes, Robert Ebido, Jeff Grozen, Josef Colquin A. Chua, Domingo Atienza, JR.
Life of this patent
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Abstract
A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.
Claims17
A pressure contact assembly comprising:
- a power substrate comprising a first surface coupled to a ceramic tile, the first surface comprising a first cavity;
- a chip soldered onto the first surface;
- and
- a lead to be inserted into the first cavity, the lead comprising:
- a top portion to connect to an external device;
- and
- a bottom portion with a modified portion to fit into the first cavity.
4 more elements
A pressure contact assembly comprising:
- a power substrate comprising a first surface coupled to a ceramic tile, the first surface comprising a cavity;
- and
- a lead comprising:
- a first portion to connect to an external device;
- and
- a second portion coupled to the first portion, the second portion being perpendicular to the first portion, and the second portion comprising a modification, wherein the modification is press-fit into the cavity.
3 more elements
Dependencies are inferred from the claim text.