Electronic devices and methods of manufacturing electronic devices

An electronic device, comprising:

• a first substrate;
• an electronic component disposed over the first substrate;
• a first interconnect structure coupled to the first substrate lateral to the electronic component;
• a second interconnect structure coupled to the first interconnect structure;
• a fusible material coupling the first interconnect structure with the second interconnect structure and coupling the first interconnect structure with the first substrate;
• and
• a second substrate disposed over the electronic component and the second interconnect structure, wherein the second interconnect structure is coupled to the second substrate by the fusible material.

A method of manufacturing an electronic device, comprising:

• providing a first substrate;
• providing an electronic component coupled to the first substrate;
• providing a first interconnect structure coupled to the first substrate lateral to the electronic component;
• providing a second substrate comprising a second interconnect structure coupled to the second substrate;
• aligning the first substrate and second substrate with the first interconnect structure over the second interconnect structure;
• and
• coupling the first interconnect structure with the second interconnect structure using a fusible material.