Electronic devices and methods of manufacturing electronic devices

An electronic device, comprising:

• a first substrate;
• an electronic component disposed over an inner side of the first substrate;
• a vertical interconnect structure disposed over the inner side of the first substrate, the vertical interconnect structure comprising:
• a metallic core ball coupled to the first substrate;
• a wire coupled to the metallic core ball opposite the first substrate;
• a fusible material coupled to the metallic core ball, the wire, and the first substrate;
• and
• a first encapsulant disposed around the wire with a tip of the wire protruding from the first encapsulant;
• a second substrate disposed over the electronic component and the vertical interconnect structure, wherein the wire of the vertical interconnect structure is coupled to the second substrate;
• and
• a second encapsulant disposed over the electronic component, around the metallic core ball, and between inner sidewalls of the first encapsulant.

A method of making an electronic device, comprising:

• providing a first substrate;
• providing a wire coupled to an inner side of the first substrate;
• providing a first encapsulant over and around the wire with a tip of the wire protruding from the first encapsulant;
• providing a metallic core structure over the wire;
• coupling an electronic component to a second substrate;
• coupling the metallic core structure to the second substrate, wherein a fusible material around the metallic core structure is coupled to the second substrate and the wire;
• and
• providing a second encapsulant between the first substrate and the second substrate, over the electronic component, and around the metallic core structure.