Electronic devices and methods of manufacturing electronic devices

A method to manufacture an electronic device, comprising:

• providing a substrate comprising a first side, a second side opposite the first side of the substrate, and a first conductive structure;
• providing an electronic component coupled to the first conductive structure at the first side of the substrate, wherein the electronic component comprises a first side facing the first side of the substrate and a second side opposite the first side of the electronic component;
• providing a plurality of vertical interconnects disposed around the electronic component, wherein the plurality of vertical interconnects are coupled to the first conductive structure at the first side of the substrate;
• providing a thermal body coupled to the second side of the electronic component, wherein the thermal body comprises a first side facing the second side of the electronic component and a second side opposite the first side of the thermal body;
• providing an interposer coupled to the plurality of vertical interconnects, wherein the interposer comprises a plurality of inner sidewalls defining a central opening, and wherein the plurality of inner sidewalls are disposed around the thermal body;
• and
• providing an encapsulant disposed between the thermal body and the plurality of inner sidewalls of the interposer, around the plurality of vertical interconnects, and around the electronic component, wherein the second side of the thermal body is exposed from the encapsulant.

An electronic device, comprising:

• a substrate comprising a first side, a second side opposite the first side of the substrate, and a first conductive structure;
• an electronic component coupled to the first conductive structure at the first side of the substrate, wherein the electronic component comprises a first side facing the first side of the substrate and a second side opposite the first side of the electronic component;
• a plurality of vertical interconnects disposed around the electronic component, wherein the plurality of vertical interconnects are coupled to the first conductive structure at the first side of the substrate;
• a thermal body coupled to the second side of the electronic component, wherein the thermal body comprises a first side facing the second side of the electronic component and a second side opposite the first side of the thermal body;
• an interposer coupled to the plurality of vertical interconnects, wherein the interposer comprises a plurality of inner sidewalls defining a central opening, wherein the plurality of inner sidewalls are disposed around the thermal body, and wherein the thermal body is exposed in the central opening;
• and
• an encapsulant disposed between the interposer and the substrate.