Electronic package having stepped stacked substrate structure

A stacked substrate structure, comprising:

• a plurality of stacked substrates, each substrate including
• a first planar surface,
• a second planar surface opposite the first planar surface,
• wherein adjacent substrates of the plurality of stacked substrates are stacked so that the second planar surface of each upper substrate of the adjacent substrates extends beyond the first planar surface of each lower substrate of the adjacent substrates to form planar connection surfaces at the second planar surface of the upper substrate of the adjacent substrates;
• a redistribution layer overlying the plurality of stacked substrates;
• and
• one or more conductive pillars extending from the planar connection surface of each upper substrate of the adjacent substrates to electrically connect one or more electronic components of each upper substrate to the redistribution layer, wherein the one or more conductive pillars extend perpendicularly from the planar connection surfaces of each upper substrate to the redistribution layer.

A method of forming stacked substrate structure, comprising:

• stacking a plurality of substrates, each substrate including
• a first planar surface,
• a second planar surface opposite the first planar surface,
• wherein adjacent substrates of the plurality of stacked substrates are stacked so that the second planar surface of each upper substrate of the adjacent substrates extends beyond the first planar surface of each lower substrate of the adjacent substrates to form planar connection surfaces at the second planar surface of the upper substrate of the adjacent substrates;
• forming a redistribution layer overlying the plurality of substrates;
• and
• forming one or more conductive pillars extending from the planar connection surface of each upper substrate of the adjacent substrates to electrically connect one or more electronic components of each upper substrate to the redistribution layer, wherein the one or more conductive pillars extend perpendicularly from the planar connection surfaces of each upper substrate to the redistribution layer.