Device including conductive posts thermally coupling a die and an interposer structure

Abstract

A device includes a substrate and a die. A first side of the die is electrically coupled to the substrate. The device also includes interconnect conductors electrically coupled to the die through conductive paths of the substrate. The device also includes an interposer structure that includes a first side and a second side. The first side includes first contacts electrically coupled to the interconnect conductors, and the second side includes second contacts. The interposer structure also includes a plurality of patterned conductive structures electrically coupled to the first contacts and to second contacts. The device further includes a plurality of conductive posts between a second side of the die and to the first side of the interposer structure and configured to conduct heat from the die to the interposer structure.

Dependencies are inferred from the claim text.