Semiconductor package and method of fabricating the same

A semiconductor package, comprising:

• a first semiconductor die, comprising:
• a first semiconductor substrate;
• and
• a first interconnection layer disposed on the first semiconductor substrate;
• a second semiconductor die, comprising:
• a second semiconductor substrate;
• a second interconnection layer disposed on the second semiconductor substrate;
• and
• backside vias, extending from the second interconnection layer passing through the second semiconductor substrate and to a backside surface of the second semiconductor die;
• and
• a redistribution layer sandwiched between the first semiconductor die and the second semiconductor die, wherein the redistribution layer is physically and electrically connected to the backside vias of the second semiconductor die, and electrically connected to the first interconnection layer.

A method of fabricating a semiconductor package, comprising:

• providing a plurality of second semiconductor dies;
• forming a redistribution layer, wherein the plurality of second semiconductor dies is disposed on and electrically connected to the redistribution layer;
• bonding a plurality of first semiconductor dies to the redistribution layer through a first bonding layer, wherein the first bonding layer is disposed on the plurality of first semiconductor dies and comprises a plurality of first bonding pads, and wherein after bonding the plurality of first semiconductor dies to the redistribution layer, the redistribution layer is electrically connected to the plurality of first bonding pads, and backside surfaces of the plurality of second semiconductor dies are facing active surfaces of the plurality of first semiconductor dies;
• and
• forming a plurality of conductive terminals disposed on and electrically connected to the plurality of second semiconductor dies.