US 2026/0076252 A1 · Power Semiconductor Device Package

Abstract

Power semiconductor device packages are provided. In one example, a power semiconductor device package includes a housing, a first semiconductor die and a second semiconductor die, and a plurality of electrical leads extending from the housing. At least one electrical lead of the plurality of electrical leads may be coupled to each of the first semiconductor die and the second semiconductor die. The second semiconductor die may be a different type of semiconductor device relative to the first semiconductor die. In one example, the power semiconductor device package includes a creepage cutout in the housing that provides a creepage distance between at least two electrical leads of the plurality of electrical leads.

Claims20

Dependent claims

A discrete power semiconductor device package, comprising:

a housing;
a first semiconductor die and a second semiconductor die, wherein the first semiconductor die is a different type of semiconductor device relative to the second semiconductor die;
and
a plurality of electrical leads extending from the housing, at least one electrical lead of the plurality of electrical leads coupled to each of the first semiconductor die and the second semiconductor die.

1 more element

Dependencies are inferred from the claim text.

Power Semiconductor Device Package

Life of this patent

Power Semiconductor Device Package

Life of this patent

Abstract

Claims20