Back to results
US 2026/0076250 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChih-Hsien CHIU, Wen-Jung TSAI, Ko-Wei CHANG, Chien-Cheng LIN
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, in which an electronic element is disposed on a carrier structure, and an interposer is stacked on the electronic element. Further, a wire is connected to the interposer and grounds the carrier structure, such that the wire and the interposer surround the electronic element. Therefore, the wire can be used as a shielding element when the electronic package is in operation to prevent the electronic element from being subjected to external electromagnetic interference.
Claims11
An electronic package, comprising:
- a carrier structure having a routing layer;
- an electronic element disposed on the carrier structure and electrically connected to the routing layer;
- an interposer disposed on the electronic element and including a semiconductor substrate, wherein the semiconductor substrate has a first surface and a second surface opposing the first surface, wherein the first surface of the semiconductor substrate is arranged with a plurality of first contacts and at least one second contact, and a plurality of conductors are formed on the plurality of first contacts, wherein the interposer further includes a metal layer electrically connected to the at least one second contact;
- and
- at least one wire connected to the at least one second contact and the carrier structure and grounding the carrier structure.
2 more elements
Dependencies are inferred from the claim text.