Hybrid Bonding Strength and Thermal Conductivity Leveraging Inorganic-convertible Polymers
AssigneeApple Inc.
InventorsSanjay Dabral, Jimin Yao, SivaChandra Jangam, Vidhya Ramachandran
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Abstract
Integrated circuit (“IC”) structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.
Claims31
An integrated circuit (“IC”) structure comprising:
- an electronic component including a first bonding surface;
- a die including a second bonding surface, the second bonding surface directly bonded to the first bonding surface;
- and
- a side fill material along a periphery of the die, the side fill material being characterized by a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of the second bonding surface, wherein the side fill material occupies one or more voids present at an interface between the first bonding surface and the second bonding surface.
A method for sealing a die periphery comprising:
- directly bonding a first bonding surface of an electronic component to a second bonding surface of a die;
- applying a side fill material to a periphery of the die, wherein the side fill material occupies one or more voids present at an interface between the first bonding surface and the second bonding surface;
- and
- activating the side fill material, wherein the side fill material is characterized by a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of the second bonding surface.
An electronic package comprising:
- an electronic component including a first bonding surface;
- a die including a second bonding surface, the second bonding surface directly bonded to the first bonding surface;
- a gap fill material to encapsulate the die;
- and
- a thermal solution over the die;
- wherein a thermal bonding layer bonds the die to the thermal solution.
A method for forming an electronic package comprising:
- grinding a gap fill material to expose a top surface of a die, the die encapsulated by the gap fill material and located over an electronic component, wherein a first bonding surface of the electronic component is directly bonded to a second bonding surface of the die;
- applying a thermal bonding layer to the top surface of the die and the gap fill material;
- and
- activating the thermal bonding layer.
Dependencies are inferred from the claim text.