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US 2026/0076245 A1Published application
Metal bump containing structure
AssigneeInternational Business Machines Corporation
InventorsToyohiro Aoki, Takahito Watanabe, KOKI NAKAMURA
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Abstract
A metal bump containing structure is provided which has a substantially flat top surface and enhanced coplanarity with other like metal bump containing structures. The metal bump containing structures include a metal bump having a curved top surface, and a first metal liner located along an outermost sidewall and present at least partially on the curved top surface of the metal bump.
Claims20
A structure comprising:
- a metal bump containing structure having a substantially flat top surface and located on top of a substrate, the metal bump containing structure comprises a metal bump having a curved top surface, and a first metal liner located along an outermost sidewall and present at least partially on the curved top surface of the metal bump.
A method comprising:
- forming a metal seed layer on a substrate;
- plating a metal bump on the metal seed layer, the metal bump having a curved top surface;
- and
- plating a first metal liner on an outermost sidewall and at least partially on the curved top surface of the metal bump, wherein the plating of the first metal liner is performed in a plating solution and in the presence of a plate fixture that is in contact with, or close proximity to, the metal bump.
1 more element
Dependencies are inferred from the claim text.