Method and an apparatus for forming an electronic device
AssigneeJCET STATS ChipPAC Korea Limited
InventorsYeoJun YUN, SeungHyun LEE, MinSung LEE, HeeSoo LEE
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Abstract
A method and an apparatus for forming an electronic device is provided. The method comprises: providing a substrate; disposing at least one electronic component on the substrate via a solder paste; applying an inert atmosphere to the substrate and the solder paste, wherein the inert atmosphere has a reduced oxygen partial pressure compared with air atmosphere; and reflowing the solder paste by a heating process within the inert atmosphere to reduce voids formed within the solder paste during the reflowing of the solder paste.
Claims14
A method for forming an electronic device, the method comprising:
- providing a substrate;
- disposing at least one electronic component on the substrate via a solder paste;
- applying an inert atmosphere to the substrate and the solder paste, wherein the inert atmosphere has a reduced oxygen partial pressure compared with air atmosphere;
- and
- reflowing the solder paste by a heating process within the inert atmosphere to reduce voids formed within the solder paste during the reflowing of the solder paste.
An apparatus for forming an electronic device, the apparatus comprising:
- a platform configured for placing a substrate, wherein the substrate is disposed with at least one electronic component via a solder paste;
- a heating device configured for heating the substrate and the solder paste to reflow the solder paste;
- a reflowing chamber disposed on the platform and configured for reflowing the solder paste when the substrate is disposed within the reflowing chamber;
- a vacuum source in communication with the reflowing chamber and configured for applying a vacuum pressure to the substrate and the solder paste when the substrate is disposed within the reflowing chamber;
- and
- a gas supply in communication with the reflowing chamber and configured for applying an inert gas to the substrate and the solder paste when the substrate is disposed within the reflowing chamber, wherein the vacuum pressure and the inert gas applied to the solder paste and the substrate reduce voids formed within the solder paste during the reflowing of the solder paste within the reflowing chamber.
Dependencies are inferred from the claim text.