Die flip bonding device and semiconductor package manufacturing method

A die flip bonding device comprising:

• a substrate holder configured to provide a substrate including a plurality of die stacks having a gap in a first direction, the plurality of die stacks being wire-bonded;
• a first moving body configured to move to a first position to pick up a first uppermost die of a first die stack among the plurality of die stacks, and then half-flip the first uppermost die in the first direction to move the first uppermost die to a second position;
• and
• a second moving body configured to move to the second position to receive the first uppermost die of the first die stack from the first moving body, and after the movement of the first moving body, half-flip the first uppermost die of the first die stack in the first direction at the second position to move the first uppermost die to a third position above an uppermost die of a second die stack among the plurality of die stacks.