Method for manufacturing sinter bonding film, and method for manufacturing power semiconductor package
AssigneeFoundation for Research and Business, Seoul National University of Science and Technology
InventorsJonghyun LEE, Woo Lim CHOI
Life of this patent
Estimating the term…
Abstract
A method for manufacturing sinter bonding film, includes: preparing a resin formulation; preparing a metal filler mixture; mixing the resin formulation and the metal filler mixture, thereby preparing a paste for film manufacturing; and manufacturing a sinter bonding film by using the paste for film manufacturing. The metal filler mixture includes a metal powder and a reducing agent, copper metal (Cu) corresponds to respective particles in the metal powder, and the surface of the respective particles in the metal powder undergoes acid treatment or non-treatment.
Claims34
A method of forming a sinter-bonding film comprising:
- preparing a resin formulation;
- preparing a metal filler mixture;
- mixing the resin formulation with the metal filler mixture to prepare a film-forming paste;
- and
- forming a sinter-bonding film using the film-forming paste,
- wherein the metal filler mixture comprises:
- a metal powder;
- and
- a reducing agent,
- wherein a copper (Cu) metal corresponds to respective particles of the metal powder and
- a surface of each particle in the metal powder is subjected to acid treatment or non-treatment.
A method of manufacturing a power semiconductor package comprising:
- preparing a first bonding subject on a heating stage;
- sequentially placing a sinter-bonding film and a second bonding subject on the first bonding subject;
- and
- applying a thermal compression sinter-bonding process to the first bonding subject, the sinter-bonding film and the second bonding subject,
- wherein the sinter-bonding film is formed using a metal filler mixture and a resin formulation before the thermal compression sinter-bonding process,
- the metal filler mixture comprises a metal powder and a reducing agent,
- a copper (Cu) metal is applied to each particle in the metal powder, and
- a surface of each particle in the metal powder is subjected to acid treatment or non-treatment.
Dependencies are inferred from the claim text.