Semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorMeng-Wei HSIEH
Life of this patent
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Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first electronic component, and an electronic device. The first electronic component is disposed over the substrate. The electronic device is at least partially embedded in the substrate. The electronic device includes a second electronic component and a reinforcement. The second electronic component is configured for providing a regulated voltage to the first electronic component. The reinforcement supports the second electronic component.
Claims20
A semiconductor package structure, comprising:
- a substrate comprising a glass material, the substrate including a through hole penetrating the substrate from a top surface to a bottom surface of the substrate;
- a first electronic component disposed over the substrate;
- and
- a second electronic component disposed in the through hole and configured for providing a regulated voltage to the first electronic component.
A semiconductor package structure, comprising:
- a plurality of first electronic components;
- and
- a substrate including a plurality of cavities accommodating the plurality of first electronic components,
- wherein at least one of the plurality of first electronic components is configured for providing a regulated voltage to an external component.
Dependencies are inferred from the claim text.