Pre-fabricated pin-based vertical electrical connectivity in a package substrate

A method of manufacturing a substrate, comprising:

• forming a plurality of through holes through a substrate core of the substrate;
• aligning a plurality of metal pins in each of the plurality of through holes of the substrate core such that each of the plurality of metal pins extends at least to both a top and bottom surface of the substrate core;
• filling each of the plurality of through holes with a resin in an annulus formed between the plurality of through holes and each of the plurality of metal pins;
• allowing the resin to cure;
• grinding both sides of the substrate core to allow exposure of each of the plurality of metal pins on both the top and bottom surfaces of the substrate core;
• fabricating metal pads on each exposed end of each of the plurality of metal pins extended to the top and bottom surfaces of the substrate core;
• and
• forming at least one layer on the metal pads on at least one of the top and bottom surfaces of the substrate core.

An assembled substrate, comprising:

• a substrate core including a plurality of through holes located therethrough;
• a plurality of metal pins aligned in the plurality of through holes such that each of the plurality of metal pins extends at least to both a top and bottom surface of the substrate core;
• at least one layer deposited on at least one of the top and bottom surfaces of the substrate core after each of the plurality of metal pins have been aligned in the through holes of the substrate core;
• at least one integrated circuit (IC) affixed to an outermost one of the at least one layer deposited on one side of the substrate core;
• and
• a printed circuit board (PCB) affixed to an outermost one of the at least one layer deposited on another side of the substrate core.