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US 2026/0076227 A1Published application
Semiconductor structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSHUO-MAO CHEN, FENG-CHENG HSU, SHIN-PUU JENG
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Abstract
A method includes: forming an interposer die using a substrate, the interposer die including a plurality of conductive vias in the substrate; bonding the interposer die to a first redistribution layer (RDL); encapsulating the interposer die; forming a second RDL over the interposer die on a side opposite to the first RDL; bonding a first semiconductor die with one of the first RDL and the second RDL; and encapsulating the first semiconductor die.
Claims20
A method, comprising:
- forming an interposer die using a substrate, the interposer die comprising a plurality of conductive vias in the substrate;
- bonding the interposer die to a first redistribution layer (RDL);
- encapsulating the interposer die;
- forming a second RDL over the interposer die on a side opposite to the first RDL;
- bonding a first semiconductor die with one of the first RDL and the second RDL;
- and
- encapsulating the first semiconductor die.
4 more elements
A method, comprising:
- bonding an interposer die and a first semiconductor die to a first redistribution layer (RDL), the interposer die comprising a plurality of conductive vias in a substrate;
- encapsulating the interposer die and the first semiconductor die;
- forming a second RDL on a side of the interposer die opposite to the first RDL;
- and
- bonding a second semiconductor die with the first RDL on a side of the first RDL opposite to the interposer die.
2 more elements
A method, comprising:
- bonding at least one interposer die to a first redistribution layer (RDL) through a plurality of first connectors, wherein each of the at least one interposer die comprises a plurality of conductive vias;
- encapsulating the first connectors with a first encapsulating material;
- encapsulating the at least one interposer die and the first encapsulating material with a second encapsulating material;
- and
- planarizing the at least one interposer die and the second encapsulating material.
2 more elements
Dependencies are inferred from the claim text.