US 2026/0076223 A1 · SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME

Abstract

A semiconductor structure includes a first semiconductor device, a second semiconductor device, a connection device and a redistribution circuit structure. The first semiconductor device is bonded on the second semiconductor device. The connection device is bonded on the second semiconductor device and arranged aside of the first semiconductor device, wherein the connection device includes a first substrate and conductive vias penetrating through the first substrate and electrically connected to the second semiconductor device. The redistribution circuit structure is located over the second semiconductor device, wherein the first semiconductor device and the connection device are located between the redistribution circuit structure and the second semiconductor device. The redistribution circuit structure and the first semiconductor device are electrically connected to the second semiconductor device through the conductive vias of the connection device.

Claims20

Dependent claims

A semiconductor structure, comprising:

a first semiconductor device and a second semiconductor device, wherein the first semiconductor device is disposed over the second semiconductor device;
a connection device, disposed over the second semiconductor device and arranged aside of the first semiconductor device, wherein the connection device comprises a first substrate and conductive vias penetrating through the first substrate and electrically coupled to the second semiconductor device;
and
an insulating encapsulation, laterally encapsulating the first semiconductor device and the connection device, wherein the insulating encapsulation is in contact with the second semiconductor device, and a sidewall of the insulating encapsulation is substantially aligned with a sidewall of the second semiconductor device,
wherein the first semiconductor device is electrically coupled to the second semiconductor device through the conductive vias of the connection device.

2 more elements

A semiconductor structure, comprising:

a first integrated circuit component comprising:
a device portion;
and
at least one bridge portion, wherein the device portion is aside of the at least one bridge portion;
a second integrated circuit component, disposed underneath the first integrated circuit component, wherein the device portion is electrically coupled to the second integrated circuit component through the at least one bridge portion;
an insulating encapsulation, laterally encapsulating the device portion and the at least one bridge portion, wherein the insulating encapsulation is in contact with the second integrated circuit component, and a sidewall of the insulating encapsulation is substantially aligned with a sidewall of the second integrated circuit component;
a redistribution circuit structure, disposed over and connected to the first integrated circuit component, wherein the redistribution circuit structure is electrically coupled to the second integrated circuit component through the first integrated circuit component;
and
conductive terminals, disposed over and connecting to the redistribution circuit structure, wherein the redistribution circuit structure is located between the first integrated circuit component and the conductive terminals.

6 more elements

A semiconductor structure, comprising:

a first integrated circuit component comprising:
a device portion;
and
at least one bridge portion, wherein the device portion is aside of the at least one bridge portion;
a second integrated circuit component, disposed over a side of the first integrated circuit component, wherein the device portion is electrically coupled to the second integrated circuit component through the at least one bridge portion;
a redistribution circuit structure, disposed over an opposite side of the first integrated circuit component, wherein the redistribution circuit structure is electrically coupled to the second integrated circuit component through the first integrated circuit component;
and
a circuit substrate, disposed over the redistribution circuit structure and being electrically coupled to the first integrated circuit component through the redistribution circuit structure.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor structure and method manufacturing the same

Life of this patent

Semiconductor structure and method manufacturing the same

Life of this patent

Abstract

Claims20