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US 2026/0076218 A1Published application
Substrate attach pads and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsLijuan WANG, Ian Ceazar Bucayon BARIAS, JingJing ZUO, XinYue MAO
Life of this patent
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Abstract
Implementations of a leadframe may include a substrate attach portion including a first largest planar surface and a second largest planar surface on a side opposing the first largest planar surface; and a substrate opening formed in a material of the first largest planar surface of the substrate attach portion. The substrate opening may be configured to receive a perimeter of a substrate therein.
Claims20
A leadframe comprising:
- a substrate attach portion comprising a first largest planar surface and a second largest planar surface on a side opposing the first largest planar surface;
- and
- a substrate opening formed in a material of the first largest planar surface of the substrate attach portion;
- wherein the substrate opening is configured to receive a perimeter of a substrate therein.
1 more element
A semiconductor package comprising:
- a leadframe comprising:
- a substrate attach portion;
- and
- a substrate recess formed into a material of the substrate attach portion;
- wherein the substrate recess receive an entire perimeter of a substrate therein;
- and
- the substrate comprising at least one semiconductor die coupled thereto, the substrate coupled into the substrate recess.
4 more elements
A method of forming a substrate, the method comprising:
- providing a substrate attach portion with a largest planar surface;
- and
- one of stamping, punching, drilling, etching, or cutting a substrate recess into a material of the largest planar surface of the substrate attach portion;
- wherein the substrate recess is sized to receive an entire perimeter of a second substrate therein.
1 more element
Dependencies are inferred from the claim text.