Method of forming semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu, Tang-Wei Huang, Fu Wei Liu
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Abstract
A method of forming a semiconductor device includes the following steps. A substrate is provided. A die is placed on the substrate, wherein an empty through hole penetrates through the die. A cavity is formed to penetrate through the substrate, to communicate with the empty through hole of the die. A liner is formed on surfaces of the empty through hole of the die and the cavity of the substrate.
Claims20
A method of forming a semiconductor device, comprising:
- providing a substrate;
- placing a die on the substrate, wherein an empty through hole penetrates through the die;
- forming a cavity to penetrate through the substrate, to communicate with the empty through hole of the die;
- and
- forming a liner on surfaces of the empty through hole of the die and the cavity of the substrate.
A method of forming a semiconductor device, comprising:
- providing a first semiconductor layer;
- placing a second semiconductor layer on the first semiconductor layer, wherein a through hole penetrates through the second semiconductor layer, and the through hole of the second semiconductor layer is empty;
- after placing the second semiconductor layer on the first semiconductor layer, defining a cavity in the first semiconductor layer, wherein the cavity is in spatial communication with the through hole;
- and
- forming a liner on surfaces of the through hole of the second semiconductor layer and the cavity of the first semiconductor layer.
A method of forming a semiconductor device, comprising:
- forming a plurality of through holes in a die;
- placing the die on a substrate through a bonding layer;
- forming a cavity to communicate with the through holes of the die;
- and
- forming a liner on surfaces of the cavity of the substrate, the bonding layer and the through holes of the die.
Dependencies are inferred from the claim text.