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US 2026/0076209 A1Published application
Electromagnetic interference shielding package structures and fabricating methods thereof
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsPeng Chen, Houde Zhou
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Abstract
The present disclosure provides a semiconductor structure, comprising a die/die stack attached on a substrate, a conductive top block covering a top surface of the die/die stack, and a plurality of ground wires conductively connect the conductive top block and to the substrate. The conductive top block, the plurality of ground wires, and the substrate form a Faraday cage to provide an electromagnetic interference shielding of the die/die stack.
Claims20
A semiconductor structure, comprising:
- a substrate;
- a first die/die stack disposed on the substrate in a first direction;
- a conductive top block disposed on the first die/die stack in the first direction;
- a plurality of ground wires connecting the conductive top block and the substrate;
- a plurality of signal wires connecting the first die/die stack and the substrate;
- a mold compound layer in contact with a sidewall of the first die/die stack in a second direction perpendicular to the first direction;
- a first adhesive film located between the substrate and the first die/die stack;
- and
- a second adhesive film located between the first die/die stack and the conductive top block and in contact with the first die/die stack,
- wherein a portion of at least one signal wire of the plurality of signal wires extends through the second adhesive film.
7 more elements
A semiconductor structure, comprising:
- a substrate, a first die/die stack, a conductive top block and a second die/die stack stacked together in a first direction;
- a plurality of ground wires connecting the conductive top block and the substrate;
- a plurality of signal wires connecting the first die/die stack and the substrate;
- a first adhesive film located between the substrate and the first die/die stack;
- and
- a second adhesive film located between the first die/die stack and the conductive top block and in contact with the first die/die stack,
- wherein a portion of at least one signal wire of the plurality of signal wires extends through the second adhesive film, and
- wherein the first die/die stack is located between the substrate and the conductive top block, and the second die/die stack is located on a side of the conductive top block away from the first die/die stack.
5 more elements
Dependencies are inferred from the claim text.