Manufacturing method of electromagnetic shielding structure and packaging structure

A manufacturing method of an electromagnetic shielding structure, comprising:

• providing a substrate having a first element;
• forming a shielding portion on the substrate by using 3D printing technology, wherein the shielding portion is arranged at a periphery of the first element;
• and the step comprises:
• constructing a three-dimensional model of the shielding portion;
• identifying a target position on the substrate;
• and laying a printing material at the target position in accordance with the three-dimensional model to pre-form the shielding portion;
• injecting a molding compound onto the substrate to form an encapsulation that encapsulates the first element and the shielding portion, wherein the molding compound undergoes a crosslinking reaction with the printing material;
• grinding the encapsulation so that the shielding portion is exposed from a surface of the encapsulation;
• and
• forming a metal layer on the surface of the encapsulation, wherein the metal layer is electrically connected to the shielding portion, and at least one of the metal layer and the shielding portion has grounding properties.