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US 2026/0076201 A1Published application
Lid or stiffener attachment structure with a hybrid adhesive
AssigneeIntel Corporation
InventorsNrup Liljibhai BALAR, Zheng REN, Shaoyin GUO
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Abstract
An embodiment may include an apparatus, that comprises a first substrate and an adhesive layer on the first substrate. In an embodiment, the adhesive layer comprises a first adhesive, where the first adhesive is a polymer that comprises silicon and oxygen, and a second adhesive, where the second adhesive is an epoxy. In an embodiment, the first adhesive is adjacent to the second adhesive. In an embodiment, the apparatus further comprises a second substrate coupled to the first substrate by the adhesive layer.
Claims20
An apparatus, comprising:
- a first substrate;
- an adhesive layer on the first substrate, wherein the adhesive layer comprises:
- a first adhesive, wherein the first adhesive is a polymer that comprises silicon and oxygen;
- and
- a second adhesive, wherein the second adhesive is an epoxy, and wherein the first adhesive is adjacent to the second adhesive;
- and
- a second substrate coupled to the first substrate by the adhesive layer.
4 more elements
An apparatus, comprising:
- a package substrate;
- a die coupled to the package substrate;
- and
- a frame coupled to the package substrate by a hybrid adhesive layer, wherein the hybrid adhesive layer comprises:
- a plurality of pillars, wherein the plurality of pillars comprise a first material composition;
- and
- a matrix that surrounds the plurality of pillars, wherein the matrix comprises a second material composition that is different than the first material composition.
4 more elements
An apparatus, comprising:
- a package substrate;
- a layer coupled to the package substrate by an adhesive, and wherein the adhesive comprises:
- an epoxy matrix;
- and
- a plurality of silicone structures embedded in the epoxy matrix.
2 more elements
Dependencies are inferred from the claim text.