Semiconductor package and cooling system

A semiconductor package comprising:

• a package substrate;
• an interposer disposed on the package substrate;
• semiconductor chips mounted on the interposer;
• a molding member on the interposer and surrounding the semiconductor chips;
• a sealing member extending along interfaces between the molding member and the semiconductor chips;
• and
• a heat dissipation member on the package substrate and covering the interposer, the semiconductor chips, the molding member, and the sealing member,
• wherein the heat dissipation member includes a lower structure contacting an upper surface of the package substrate and an upper structure on the lower structure and extending over the sealing member,
• wherein the upper structure includes a lower microchannel extending in a first horizontal direction, an upper microchannel extending in a second horizontal direction crossing the first horizontal direction, and a plurality of micropillars disposed on at least one of the lower microchannel or the upper microchannel.

A semiconductor package comprising:

• a package substrate;
• an interposer disposed on the package substrate;
• semiconductor chips mounted on the interposer;
• a molding member on the interposer and surrounding the semiconductor chips;
• a sealing member extending along interfaces between the molding member and the semiconductor chips;
• and
• a heat dissipation member on the package substrate, connected to an external cooling system, and covering the interposer, the semiconductor chips, the molding member, and the sealing member,
• wherein the heat dissipation member includes:
• a coolant inlet port exposed through an upper surface of the heat dissipation member;
• a coolant outlet port exposed through the upper surface of the heat dissipation member;
• and
• a coolant transfer path extending between the coolant inlet port and the coolant outlet port and configured to thermally connect coolant to central portions of respective upper surfaces of the semiconductor chips,
• wherein the external cooling system comprises:
• a first interface pipe connected to the coolant inlet port;
• a water cooling pump configured to deliver coolant through the first interface pipe into the coolant transfer path;
• a second interface pipe connected to the coolant outlet port;
• and
• a heat dissipater connected to the second interface pipe and configured to release heat from coolant exhausted from the coolant transfer path.