Package with Heat Dissipation Structure and Method for Forming the Same

A method comprising:

• attaching a first integrated circuit device to an interposer, wherein the first integrated circuit device comprises a die and a heat dissipation structure over the die, wherein the heat dissipation structure includes a first substrate having trenches in a first side and a sacrificial material in the trenches, wherein the die is between the heat dissipation structure and the interposer;
• forming an encapsulant over the interposer and along sidewalls of the first integrated circuit device;
• removing the sacrificial material from the trenches in the first substrate of the heat dissipation structure to form channels;
• and
• attaching a lid to the heat dissipation structure to form a cavity, wherein the cavity is enclosed by the lid and the heat dissipation structure.

A method comprising:

• forming trenches in a heat dissipation substrate;
• filling the trenches with a sacrificial material to form strips;
• bonding the heat dissipation substrate to a first integrated circuit die;
• after bonding the heat dissipation substrate to the first integrated circuit die, attaching the first integrated circuit die to an interposer;
• forming an encapsulant over the interposer and along sidewalls of the first integrated circuit die;
• removing the sacrificial material to form micro-channels in the heat dissipation substrate;
• and
• attaching a lid structure over the heat dissipation substrate, wherein the lid structure includes channels, wherein the channels are aligned with the micro-channels of the heat dissipation substrate.