Electronic devices and methods of manufacturing electronic devices

A method to manufacture an electronic device, comprising:

• providing a substrate comprising a first side, a second side opposite the first side of the substrate, and a first conductive structure;
• providing an electronic component coupled to the first conductive structure at the first side of the substrate, wherein the electronic component comprises a first side facing the first side of the substrate and a second side opposite the first side of the electronic component;
• providing a plurality of vertical interconnects disposed around the electronic component, wherein the plurality of vertical interconnects are coupled to the first conductive structure at the first side of the substrate;
• providing an interposer coupled to the plurality of vertical interconnects, wherein the interposer comprises a first side facing the first side of the substrate, a second side opposite the first side of the interposer, and a second conductive structure, and wherein the plurality of vertical interconnects are coupled to the second conductive structure at the first side of the interposer;
• providing a thermal body coupled to the second side of the electronic component and to the first side of the interposer;
• and
• providing an encapsulant disposed between the substrate and the interposer, around the thermal body, around the plurality of vertical interconnects, and around the electronic component.

An electronic device, comprising:

• a substrate comprising a first side, a second side opposite the first side of the substrate, and a first conductive structure;
• an electronic component coupled to the first conductive structure at the first side of the substrate, wherein the electronic component comprises a first side facing the first side of the substrate and a second side opposite the first side of the electronic component;
• an interposer comprising a first side facing the first side of the substrate, a second side opposite the first side of the interposer, and a second conductive structure, and wherein the interposer comprises an inner conductive region extending from the first side of the interposer to the second side of the interposer;
• a plurality of vertical interconnects disposed around the electronic component and around the inner conductive region, wherein the plurality of vertical interconnects are coupled to the first conductive structure at the first side of the substrate and are coupled to the second conductive structure at the first side of the interposer;
• and
• an encapsulant disposed between the substrate and the interposer, around the plurality of vertical interconnects, and around the electronic component.