Back to results
US 2026/0076192 A1Published application
Thermal interface material for semiconductors
OwnerYu-Sheng Lin, Jia-Shen Lan +3inventors
InventorsYu-Sheng Lin, Jia-Shen Lan, Jui Shen Chang, Jyun-Lin Wu, Yao-Chun Chuang
Life of this patent
Estimating the term…
Abstract
A thermal interface film is used between a semiconductor die and a heat sink. The thermal interface film includes at least two layers, a first layer with vertically oriented graphite and a second layer with horizontally oriented graphite. The thermal interface film directs heat away from the semiconductor die both upwards and outwards, spreading the heat over a larger surface area more quickly.
Claims20
A method for applying a heat sink to a semiconductor package, comprising:
- applying a thermal interface film over the semiconductor package;
- and
- applying the heat sink over the thermal interface film;
- wherein the thermal interface film includes at least a first layer and a second layer, the first layer comprising vertically oriented graphite and the second layer comprising horizontally oriented graphite.
1 more element
A semiconductor package, comprising:
- a semiconductor die;
- and
- a thermal interface film over the semiconductor die;
- wherein the thermal interface film includes at least a first layer and a second layer, the first layer comprising vertically oriented graphite and the second layer comprising horizontally oriented graphite.
1 more element
A processor module, comprising:
- a semiconductor die;
- a thermal interface film over the semiconductor die;
- and
- a heat sink over the thermal interface film;
- wherein the thermal interface film is a single layer comprising graphite oriented in a first volume and graphite oriented in a second volume which is different from the first volume.
2 more elements
Dependencies are inferred from the claim text.