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US 2026/0076191 A1Published application
Laminated substrate
AssigneeNGK Insulators, Ltd.
InventorsMorimichi WATANABE, Ayumi SUZUKI, Takahiro TOMITA
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Abstract
There is provided a laminated substrate including a three-layer structure composed of: a device substrate, which is composed of at least one single crystal material selected from the group consisting of Si, SiC, GaN, AlN, BN, Ga2O3, Cr2O3, LiTaO3, and LiNbO3; a metal layer on the device substrate; and a diamond layer on the metal layer.
Claims19
A laminated substrate comprising a three-layer structure composed of:
- a device substrate, which is composed of at least one single crystal material selected from the group consisting of Si, SiC, GaN, AlN, BN, Ga2O3, Cr2O3, LiTaO3, and LiNbO3;
- a metal layer on the device substrate;
- and
- a diamond layer on the metal layer.
1 more element
Dependencies are inferred from the claim text.