Semiconductor device and method of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng
Life of this patent
Estimating the term…
Abstract
Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- attaching a plurality of semiconductor dies to an interposer;
- encapsulating the plurality of semiconductor dies with an encapsulant;
- attaching a plurality of lids to the plurality of semiconductor dies, wherein each of the plurality of lids is aligned with the encapsulant and is in physical contact with at least one of the plurality of semiconductor dies;
- placing a ring around the encapsulant, the ring being separated from the encapsulant;
- and
- placing a heat sink over the plurality of lids and the ring.
A method of manufacturing a semiconductor device, the method comprising:
- thinning an encapsulant to form a first surface over an interposer, the first surface comprising the encapsulant, a first semiconductor die, and a second semiconductor die;
- placing a first lid in a first corner of the first surface and aligned with a first sidewall of the encapsulant;
- placing a second lid in a second corner of the first surface different from the first corner and aligned with a second sidewall of the encapsulant different from the first sidewall;
- and
- attaching a heat sink to the interposer with a ring.
A method of manufacturing a semiconductor device, the method comprising:
- bonding an interposer to a semiconductor wafer;
- after the bonding the interposer, bonding a first semiconductor die and a second semiconductor die to the interposer;
- after the bonding the first semiconductor die, encapsulating the first semiconductor die and the second semiconductor die with an encapsulant;
- planarizing the encapsulant to form a first planar surface;
- placing a plurality of lids on the first planar surface, wherein at least two of the plurality of lids have a sidewall planar with a respective sidewall of the encapsulant and each of the plurality of lids is in physical contact with one of the first semiconductor die or the second semiconductor die;
- after the placing the plurality of lids, placing a ring around the interposer;
- and
- attaching a heat sink to the ring over the plurality of lids.
Dependencies are inferred from the claim text.