Cell structure with intermediate metal layers for power supplies

A cell assembly on an integrated circuit, comprising:

• a power connecting cell providing a first power supply terminal;
• a cell, the power connecting cell being a first neighboring cell of the cell in a first direction, wherein the cell further comprises:
• a fin structure;
• and
• an intermediate fin structure connection metal track disposed in an intermediate fin structure connection metal layer above the fin structure, the intermediate fin structure connection metal track being connected to the fin structure;
• and
• a first intermediate gate connection metal track extending in the first direction and disposed in an intermediate gate connection metal layer above the intermediate fin structure connection metal layer, wherein the first intermediate gate connection metal track is connected to the intermediate fin structure connection metal track in the cell and connected to the first power supply terminal in the power connecting cell, and wherein the first intermediate gate connection metal track extends outside the cell and is connected to the power connecting cell.

A method of fabricating a semiconductor structure on an integrated circuit, comprising:

• forming a fin structure over a substrate;
• forming an intermediate fin structure connection metal track in an intermediate fin structure connection metal layer above the fin structure, the intermediate fin structure connection metal track being connected to the fin structure;
• and
• forming a first intermediate gate connection metal track in an intermediate gate connection metal layer above the intermediate fin structure connection metal layer, the first intermediate gate connection metal track being connected to the intermediate fin structure connection metal track, wherein the intermediate gate connection metal track is connected to a first power supply terminal, wherein the first intermediate gate connection metal track extends in a first direction, and wherein the first intermediate gate connection metal track is over a boundary line between the cell and a second neighboring cell of the cell in a second direction perpendicular to the first direction.