HETEROGENEOUS SYSTEM-ON-A-CHIP (SoC) BASED SYSTEM WITH MULTIDIMENSIONAL DIFFERENTIATION
AssigneeRockwell Collins, Inc.
InventorsMatthew P. Corbett, Eric N. Anderson, Jason R. Owen, Russ D. Uthe
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AssigneeRockwell Collins, Inc.
InventorsMatthew P. Corbett, Eric N. Anderson, Jason R. Owen, Russ D. Uthe
Estimating the term…
A method for fabrication of a heterogenous system on a chip (SoC) or other like integrated circuit (IC) device provides at least two dissimilar processing cores sharing a common functional profile but differentiated as to how the common functional profile is implemented. For example, the common functional profile may define the physical and logical configuration of each core, the functions and/or languages executable thereon, and any external interconnects to other devices or systems. However, each core may have a distinct implementation profile differentiated from that of the other on one or more levels of decomposition, based on differences in the underlying configuration of logical devices, the circuit components of said logical devices, and/or the physical design parameters including process geometries, fabrication standards, and/or fabrication processes via which the functional profile is physically realized in each core.
A method of fabricating a heterogeneous integrated circuit (IC) device, the method comprising:
A heterogeneous integrated circuit (IC) device, comprising:
Dependencies are inferred from the claim text.