Laser processing device and laser processing method

Abstract

A laser processing device for forming an opening in an insulating layer of a wiring substrate includes a light source that emits a laser beam, an objective lens that focuses the laser beam onto a surface of a wiring substrate, a control device including circuitry that control irradiation of the laser beam, and a sensor that outputs to the control device a sensor output based on plasma light emitted from the wiring substrate irradiated with the laser beam. The circuitry of the control device calculates an integrated value from start of processing at one processing position for the sensor output corresponding to each of irradiations of the laser beam at the one processing position on the wiring substrate and terminates formation of the opening at the one processing position when the integrated value satisfies a predetermined condition.

Dependencies are inferred from the claim text.